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Thermaltake CTE E660 MX Mid Tower Chassis Black

Thermaltake CTE E660 MX Mid Tower Chassis is a versatile, high-performance case designed for PC builders who value both aesthetics and functionality.

Specification Details
Case Type Mid Tower (CTE form factor)
Dimensions (H × W × D) 558.5 × 270 × 513 mm
Net Weight 15.85 kg
Material & Panels SPCC steel; 2 × 4 mm tempered glass panels
Motherboard Support Mini-ITX, Micro-ATX, ATX, E-ATX (Hidden-Connector compatible)
Maximum GPU Length 415 mm (with radiator) / 443.8 mm (without radiator)
CPU Cooler Height Clearance 166 mm
PSU Maximum Length 220 mm
Drive Bays Up to 3 × 3.5″, up to 3 × 2.5″ (various configurations)
I/O Ports 2 × USB 3.0, 1 × USB 3.2 Gen-2 Type-C, HD Audio

About the item:

  • Three-Way GPU Installation — Floating, Up-Right, or Right-Forward GPU mount with included 400 mm PCIe 4.0 riser cable for flexible layout and visual style.

  • CTE Rotated Motherboard Layout — Motherboard rotated 90° to help independent airflow for CPU & GPU, reducing thermal interference.

  • Massive Cooling & Radiator Support — Supports up to fourteen 120 mm or twelve 140 mm fans; radiators up to 420 mm on multiple sides for high-end cooling setups.

  • Interchangeable Front Panels — Choose between tempered glass front for display or perforated panel for enhanced airflow; also dual tempered glass side panels to show off internals.

  • Storage & Hidden-Connector Compatibility — Supports modern Hidden-Connector motherboards; flexible drive mounting for both 3.5-inch and 2.5-inch drives; includes generous GPU length, PSU length clearances.

Description

About Thermaltake CTE E660 MX Mid Tower Black

Category Specification
Model Thermaltake CTE E660 MX Mid Tower Chassis
Form Factor Design CTE (Centralized Thermal Efficiency) – 90° rotated motherboard, independent airflow paths for CPU and GPU
Exterior Panels Two 4 mm tempered glass panels; interchangeable front panel options (tempered glass or perforated)
Material SPCC steel construction
Dimensions Height: 558.5 mm • Width: 270 mm • Depth: 513 mm
Weight Net ~15.85 kg
Motherboard Compatibility Mini-ITX, Micro-ATX, ATX, E-ATX (including Hidden-Connector boards)
GPU Installation Options Three ways: Floating GPU bracket, Up-Right (vertical), Right-Forward (graphics card facing forward), includes 400 mm PCIe 4.0 riser cable
GPU Length Support 415 mm with radiator, 443.8 mm without radiator
CPU Cooler Height Clearance 166 mm
PSU Length Limit Up to 220 mm
Cooling & Fan Support Up to 14 × 120 mm fans or 12 × 140 mm fans; supports AIO / radiators up to 420 mm at front, rear and motherboard side
Radiator Compatibility Front, rear, motherboard-side: up to 420 mm; other positions per configuration
Storage Support Multiple HDD/SSD – can hold 3.5-inch and 2.5-inch drives in different cages/plates
I/O Panel 2 × USB 3.0, 1 × USB 3.2 Gen 2 Type-C, HD Audio on top panel
Drive Bays 3 × 3.5″, plus 1 × 2.5″ or 2 × 3.5″, and 2 × 2.5″ depending on mounting configuration
Expansion Slots 7 slots
Dust Protection Removable fine filters on top, front, bottom, rear and right side
Color Options Black (available in multiple accent/color trims)

It features a “CTE” (Centralized Thermal Efficiency) form factor, which rotates the motherboard 90°, allowing independent cold air paths for the CPU and the graphics card.

This design improves cooling by reducing interference between components.

The case supports the latest Hidden-Connector motherboards, and includes a 400 mm PCIe 4.0 riser cable so you can mount your GPU in three different ways: floating, up-right, or right-forward.

For cooling flexibility, it can accommodate up to fourteen 120 mm fans or twelve 140 mm fans, and AIO radiators up to 420 mm at the front, rear or motherboard side.

There are dual interchangeable front panels (tempered glass & perforated) so you can choose airflow over looks or vice versa.

Storage options are also generous, with support for multiple HDDs and SSDs, while I/O includes USB 3.0, USB Type-C, and audio.

The Thermaltake CTE E660 MX Mid Tower Black Chassis is ideal for those wanting custom cooling, strong airflow, and flexible component layouts.

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